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Lead-free, antimony-free solder alloy composed of 97% tin and 3% copper, featuring an integrated non-corrosive rosin flux core that eliminates the need for separate flux application. Packaged in a bulk 25 lb box with a 1/16 in. (1.6 mm) wire diameter and a melting temperature of 445°F (229°C), it delivers rapid wire flow and clean, reliable joints.
Typical Application: Ideal for electrical wiring splices, terminal connections, and electronic assemblies where corrosive residue cannot be tolerated, as well as general light-duty metal joining on copper and brass components.
